LevanChemical’sEpoxyadhesivescanbondawidevarietyofmaterials,suchasmetal,ceramicandplastic.Vailableinavarietyofformulationsandperformancecapabilities,includingfastcure,superiormoistureresistance,easeofdispense,hightoughness,andaresistancetoawiderangeofchemicals.

1.UnderfillEPoxy
2.Two-partEpoxystructureadhesive.
3.One-partEpoxysealant.

EP

Epoxy

Underfill Epoxy

We offer innovative capillary flow underfilland encapsulantsfor flip-chip, CSP and BGA devices. These are highly flowable, high purity, one-component encapsulants. They form a uniform and void-free underfilllayer to improve reliability performance by redistributing stress away from the solder interconnects as well as enhancing mechanical performance. We have formulations that quickly fill very small gap/pitch parts, offer fast cure capabilities, have a long pot and shelf life, and are reworkable. Reworkabilityallows for cost savings by allowing the removal of the underfillto enable re-use of a board.

Two-Part Epoxy structure adhesive

LevanChemical two-part Epoxy are engineered to meet a wide range of industrial bonding, sealing and assembly requirements.EP 200 structural adhesives are available in easy-to-use packages for hand-held, manual, and semi-automated applications, including cartridges, syringes, soft-squeeze bottles and dual cartridges for two-part formulations. They’re formulated to meet the rising demands in assembly design and maintenance repair for:

High performance structural bondingMulti-surface structural bondingDissimilar substrate structural bondingLow hazard structural adhesives.

One-part Epoxy sealant

LevanChemical unique high-TG epoxy technology, one-component epoxy resin specially designed for high-end waterproof connectors, can meet the waterproof requirements of IP67 grade. Completely environmentally friendly, fluidity, thixotropyadjustable. Cooperate with general automatic spray dispensing and rapid assembly process requirements..